2.5 V to 3.3 V UART, 5 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA), and 16 mode or 68 mode parallel bus interface
厂商 恩智浦封装 TFBGA361 份文档Low speed USB 8-bit MCU family with up to 8K Flash and serial communications interface
厂商 意法半导体封装 SO241 份文档Low speed USB 8-BIT MCU with 3 endpoints, Flash or ROM memory, LVD, WDG, 10-bit ADC, 2 timers, SCI, SPI
厂商 意法半导体封装 PDIP321 份文档- 厂商 圣邦微1 份文档
- 厂商 圣邦微1 份文档
Automotive-grade silicon carbide Power MOSFET 750 V, 11.4 mΩ typ., 110 A in an H²PAK-7 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 750 V, 11.4 mΩ typ., 110 A in an HU3PAK package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 900 V, 12 mΩ typ., 110 A in an H²PAK-7 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 900 V, 12 mΩ typ., 110 A in an HiP247-4 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 900 V, 12 mΩ typ., 110 A in an HiP247 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 650 V, 13.5 mΩ typ., 110 A in an HU3PAK package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 1200 V, 15 mΩ typ., 129 A in an HiP247-4 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 1200 V, 16 mΩ typ., 112 A in an H²PAK-7 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 650 V, 20 mΩ typ., 55 A in an H²PAK-7 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 650 V, 21.5 mΩ typ., 60 A in an HU3PAK package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 650 V, 20 mΩ typ., 55 A in an HiP247-4 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 650 V, 20 mΩ typ., 55 A in an HiP247 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 1200 V, 19.2 mΩ typ., 90 A in an HU3PAK package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 1200 V, 19.2 mΩ typ., 90 A in an HiP247-4 package
厂商 意法半导体1 份文档Automotive-grade silicon carbide Power MOSFET 1200 V, 18.5 mΩ typ., 100 A in an H²PAK-7 package
厂商 意法半导体1 份文档