“7” 共 16 个型号· 109 ms

  • Remote Thermal Monitor and Fan Controller with PECI 3.0 Interface and SMBus Compatible Master

    厂商 安森美封装 QFN24封装 QFN24
    1 份文档
  • NCV7327车规级AEC-Q100

    LIN Transceiver, Stand-alone

    厂商 安森美封装 SOIC-8封装 SOIC-8
    1 份文档
  • NCV7340车规级AEC-Q100

    High Speed Low Power CAN Transceiver

    厂商 安森美封装 SOIC-8封装 SOIC-8
    1 份文档
  • NCV7343车规级AEC-Q100

    CAN FD Transceiver, Low Power, with INH, WAKE and Error Detection

    厂商 安森美封装 SOIC-14封装 SOIC-14
    1 份文档
  • NCV7349车规级AEC-Q100

    High Speed Low Power CAN Transceiver

    厂商 安森美封装 SOIC-8封装 SOIC-8
    1 份文档
  • NCV7351车规级AEC-Q100

    High Speed CAN, CAN FD Transceiver

    厂商 安森美封装 SOIC-8封装 SOIC-8
    1 份文档
  • 6g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    厂商 恩智浦封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    厂商 恩智浦封装 QFN-16封装 QFN-16
    1 份文档
  • 小尺寸 RMII 10/100 以太网 PHY

    厂商 微芯科技封装 QFN-24接口 RMII(MAC 侧),SMI 管理速率 10/100Mbps(IEEE 802.3/802.3u)
    1 份文档
  • +/- 15 kV ESD protected, 1 A, 3 to 5.5 V, 250 kbps RS-232 transceiver with stand-by

    厂商 意法半导体封装 SSOP28封装 SSOP28
    1 份文档
  • 厂商 恩智浦封装 QFN20封装 QFN20
    1 份文档
  • MMA1270KEG车规级AEC-Q100

    Low G Micromachined Accelerometer

    厂商 恩智浦封装 SOIC-16封装 SOIC-16
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
    1 份文档
  • High Accuracy Low g Inertial Sensor MEMS Sensing, State Machine ASIC

    厂商 恩智浦封装 SOIC-20封装 SOIC-20
    1 份文档
  • Remote 16-bit I/O expander for I2C-bus

    厂商 恩智浦封装 SSOP24输入电压 4.5 ~ 5.5 V封装 SSOP24
    1 份文档