“I” 共 216 个型号· 15 ms

  • i.MX53 Applications Processors for Industrial Products

    厂商 恩智浦
    1 份文档
  • Dual-band 1x1 Wi-Fi 4 and Bluetooth Combo SoC

    厂商 恩智浦封装 WLCSP76工作温度 0 ~ 70 °C封装 WLCSP76
    1 份文档
  • 1x1 Wi-Fi 6 and Bluetooth Low Energy/802.15.4 Solution Family

    厂商 恩智浦
    1 份文档
  • 1x1 Dual-band Wi-Fi 6 and Bluetooth Solution

    厂商 恩智浦
    1 份文档
  • 1x1 Dual-band Wi-Fi 6, Bluetooth and 802.15.4 Tri-radio Solution

    厂商 恩智浦
    1 份文档
  • 50 nominal input / conjugate match balun to SPIRIT1, with integrated harmonic filter

    1 份文档
  • 50 nominal input / conjugate match balun to SPIRIT1 434 MHz, with integrated harmonic filter

    1 份文档
  • 50 nominal input / conjugate matched balun to ST S2-LP, 860-930 MHz with integrated harmonic filter

    1 份文档
  • 50 Ω nominal input / conjugate matched balun to ST S2-LP, 433 MHz with integrated harmonic filter

    1 份文档
  • 930 MHz with integrated harmonic filter

    1 份文档
  • MIFARE Ultralight contactless single-ticket IC

    厂商 恩智浦
    1 份文档
  • MIFARE Ultralight C - Contactless ticket IC

    厂商 恩智浦
    1 份文档
  • MF3ICDHQ1车规级

    Q1 MIFARE DESFire EV1 256B contactless smartcard IC

    厂商 恩智浦
    1 份文档
  • TESEO-VIC3DA车规级AEC-Q100

    Automotive GNSS dead-reckoning module with 6-axis IMU

    厂商 意法半导体工作温度 -40 ~ 85 °C
    1 份文档
  • TESEO-VIC6A工业级

    Automotive quad-bands GNSS module with 6-axis IMU

    厂商 意法半导体工作温度 -40 ~ 105 °C
    1 份文档
  • 728-960 MHz, 9 W Avg, 28 V Data Sheet

    厂商 恩智浦
    1 份文档
  • 575-960 MHz, 2 W Avg, 48 V Data Sheet

    厂商 恩智浦
    1 份文档
  • 575-960 MHz, 6.3 W Avg, 48 V Data Sheet

    厂商 恩智浦
    1 份文档
  • 1400-2200 MHz, 2.5 W Avg, 28 V Data Sheet

    厂商 恩智浦
    1 份文档
  • 1400-2200 MHz, 5 W Avg, 28 V Data Sheet

    厂商 恩智浦
    1 份文档