共 160 个型号· 19 ms

排序默认热度型号 A-Z
MCU 微控制器 接口芯片 TO SOT LQFP 清除筛选
  • W5500工业级

    硬件 TCP/IP 协议栈以太网控制器，SPI 接口

    厂商 WIZnet封装 LQFP-48接口 SPI（模式 0/3），理论 80MHz，保证 33.3MHz速率 10BASE-T/100BASE-TX，全/半双工自协商
    2 份文档
  • AT32F437VGT7工业级国产

    Cortex-M4F 288MHz、1MB Flash、以太网 MAC

    厂商 雅特力封装 LQFP-100内核 ARM Cortex-M4F（带 FPU、DSP、MPU）主频 288MHz
    1 份文档
  • AT32F435RGT7工业级国产

    Cortex-M4F 288MHz、1MB Flash

    厂商 雅特力封装 LQFP-64内核 ARM Cortex-M4F（带 FPU、DSP、MPU）主频 288MHz
    1 份文档
  • AT32F421C8T7工业级国产

    Cortex-M4 120MHz、64KB Flash 经济型 MCU

    厂商 雅特力封装 LQFP-48内核 ARM Cortex-M4（带 DSP、MPU，无 FPU）主频 120MHz
    1 份文档
  • STM32F103RG

    XL-density performance line ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

    厂商 意法半导体封装 LQFP64Flash 1 MBRAM 96 KB
    1 份文档
  • STM32F103C4

    Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 com. interfaces

    厂商 意法半导体封装 LQFP64Flash 32 KBRAM 10 KB
    1 份文档
  • STM32F101VF

    XL-density access line, ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, 15 timers, 1 ADC and 10 communication interfaces

    厂商 意法半导体封装 LQFP144Flash 1 MBRAM 80 KB
    1 份文档
  • CLT03-2Q3

    Self powered digital input current limiter

    厂商 意法半导体封装 SOT23工作温度 -30 ~ 125 °C封装 SOT23
    1 份文档
  • DSILC6-4XX

    ESD Protection for high speed interface

    厂商 意法半导体封装 SOT-666封装 SOT-666
    1 份文档
  • ESDALC6V1-5P6

    ESD protection for high speed interface

    厂商 意法半导体封装 SOT666封装 SOT666
    1 份文档
  • ESDAULC6-3BP6

    ESD protection for high speed interface

    厂商 意法半导体封装 SOT-666封装 SOT-666
    1 份文档
  • L9780

    Wide range air fuel sensor control interface

    厂商 意法半导体封装 LQFP48封装 LQFP48
    1 份文档
  • SPC560B40L3工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64工作温度 -40 ~ 125 °CRAM 48 KB
    1 份文档
  • SPC560B64L7工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP100工作温度 -40 ~ 125 °CRAM 96 KB
    1 份文档
  • SPC560D30L3车规级AEC-Q100

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64主频 48 MHzRAM 16 KB
    1 份文档
  • SPC560P40L1

    32-bit Power Architecture® based MCU with 320 KB Flash memory and 20 KB RAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP64主频 64 MHzFlash 320 KB
    1 份文档
  • SPC560P44L3

    32-bit Power Architecture® based MCU with 576 KB Flash memory and 40 KB SRAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP144Flash 576 KBRAM 40 KB
    1 份文档
  • SPC563M64L5

    32-bit Power Architecture® based MCU for automotive powertrain applications

    厂商 意法半导体封装 LQFP144封装 LQFP144
    1 份文档
  • SPC564A70B4

    32-bit Power Architecture® based MCU for automotive powertrain applications

    厂商 意法半导体封装 LQFP176Flash 2 MBRAM 128 KB
    1 份文档
  • SPC564A80B4

    32-bit MCU family built on the embedded Power Architecture®

    厂商 意法半导体封装 LQFP176Flash 4 MBRAM 192 KB
    1 份文档