MEMS 运动传感器

共 210 个型号

共 210 个型号· 829 ms

排序默认热度型号 A-Z
  • LPS27HHW工业级

    MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with water-resistant package

    厂商 意法半导体工作温度 -40 ~ 85 °C输入电压 1.7 ~ 3.6 V
    1 份文档
  • LPS33K工业级

    MEMS pressure sensor: 300-1200 hPa absolute digital output barometer with potted gel package

    厂商 意法半导体工作温度 -40 ~ 85 °C输入电压 1.7 ~ 3.6 V
    1 份文档
  • LPS35HW工业级

    MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with water resistant package

    厂商 意法半导体工作温度 -40 ~ 85 °C
    1 份文档
  • LPY510AL工业级

    MEMS motion sensor: dual axis pitch and yaw ±100°/s analog gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LPY5150AL工业级

    MEMS motion sensor: dual axis pitch and yaw ±1500°/s analog output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LPY530AL工业级

    MEMS motion sensor: dual axis pitch and yaw ±300°/s analog gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LPY550AL工业级

    MEMS motion sensor: dual axis pitch and yaw ±500°/s analog output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LSM303AGR

    Ultracompact high-performance eCompass module: ultralow-power 3-axis accelerometer and 3-axis magnetometer

    厂商 意法半导体封装 LGA-12输入电压 1.71 ~ 3.6 V封装 LGA-12
    1 份文档
  • LSM303AH

    Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer

    厂商 意法半导体输入电压 1.71 ~ 1.98 V
    1 份文档
  • LSM303C

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-12输入电压 1.9 ~ 3.6 V封装 LGA-12
    1 份文档
  • LSM303D

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-16输入电压 2.16 ~ 3.6 V封装 LGA-16
    1 份文档
  • LSM303DLHC

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-14输入电压 2.16 ~ 3.6 V封装 LGA-14
    1 份文档
  • LSM303DLM

    厂商 意法半导体封装 LGA-28输入电压 2.16 ~ 3.6 V封装 LGA-28
    1 份文档
  • LSM320DL

    Linear sensor module 3D accelerometer sensor and 2D gyroscope sensor

    厂商 意法半导体输入电压 2.4 ~ 3.6 V
    1 份文档
  • LSM320HAY30

    MEMS motion sensor module: 3D digital accelerometer and 2D pitch and yaw analog gyroscope

    厂商 意法半导体工作温度 40 ~ 85 °C
    1 份文档
  • LSM330D

    iNEMO inertial module: 3D accelerometer and 3D gyroscope

    厂商 意法半导体输入电压 2.4 ~ 3.6 V
    1 份文档
  • LSM330DL

    Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

    厂商 意法半导体封装 LGA-28输入电压 2.4 ~ 3.6 V封装 LGA-28
    1 份文档
  • LSM330DLC

    iNEMO inertial module: 3D accelerometer and 3D gyroscope

    厂商 意法半导体输入电压 2.4 ~ 3.6 V
    1 份文档
  • LSM333D

    iNEMO Intertial Module: 9 degrees of freedom sensing solution

    厂商 意法半导体封装 LGA-28输入电压 2.4 ~ 3.6 V封装 LGA-28
    1 份文档
  • LSM6DB0

    iNEMO advanced inertial module: 3D accelerometer, 3D gyroscope and signal processor

    厂商 意法半导体封装 LGA-22封装 LGA-22
    1 份文档