驱动芯片

共 648 个型号

共 127 个型号· 140 ms

排序默认热度型号 A-Z

DIP SOT SSOP TO QFN DFN 清除筛选

TM1650工业级国产
LED 数码管驱动控制专用电路（I2C 类接口）
厂商天微电子封装 DIP-16 / SOP-16显示模式 8 段 × 4 位或 7 段 × 4 位段驱动电流 > 25mA
2 份文档
BU931P车规级AEC-Q101
Automotive-grade high voltage ignition coil driver NPN power Darlington transistor
厂商意法半导体封装 TO-247封装 TO-247
1 份文档
BU931T车规级AEC-Q101
Automotive-grade high voltage ignition coil driver NPN power Darlington transistor
厂商意法半导体封装 TO-220封装 TO-220
1 份文档
BU941已停产
High voltage ignition coil driver NPN power Darlington transistors
厂商意法半导体封装 TO-247封装 TO-247
1 份文档
BU941ZPFI
High voltage ignition coil driver NPN power Darlington transistors
厂商意法半导体封装 TO-247封装 TO-247
1 份文档
L297
Stepper motor controllers
厂商意法半导体封装 DIP20封装 DIP20
1 份文档
L6226Q
DMOS dual full bridge driver
厂商意法半导体封装 QFN32输入电压 8 ~ 52 V封装 QFN32
1 份文档
L6235Q
DMOS driver for three-phase brushless dc motor
厂商意法半导体封装 QFN48输入电压 8 ~ 52 V封装 QFN48
1 份文档
L6384E
High voltage half-bridge driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6571
High voltage half bridge driver with oscillator
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
PM8841工业级
untitled
厂商意法半导体封装 SOT23-5工作温度 -40 ~ 125 °C封装 SOT23-5
1 份文档
PM8851工业级
厂商意法半导体封装 SOT23工作温度 -40 ~ 125 °C封装 SOT23
1 份文档
SEA05L
Advanced constant voltage and constant current controller
厂商意法半导体封装 SOT23封装 SOT23
1 份文档
STA1102R已停产
3 Gbps, 2 differential-pair channel eSATA signal re-driver
厂商意法半导体封装 QFN20封装 QFN20
1 份文档
STCF02
High power white led driver
厂商意法半导体封装 QFN20输出电流 600 mA封装 QFN20
1 份文档
STCF03
High power white LED driver with I²C interface
厂商意法半导体封装 QFN20输出电流 800 mA封装 QFN20
1 份文档
STCS1
厂商意法半导体封装 DFN8输出电流 1.5 A封装 DFN8
1 份文档
STCS1A
厂商意法半导体封装 DFN8输出电流 1.5 A封装 DFN8
1 份文档
STESB01已停产
ESBT base driver
厂商意法半导体封装 SOT23输入电压 8 ~ 20 V封装 SOT23
1 份文档
STLA01
50 mA stand-alone linear LED driver
厂商意法半导体封装 DFN6输入电压 3.75 ~ 6 V输出电流 50 mA
1 份文档