“I” 共 1,044 个型号· 8 ms

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  • IIS2DH

    Ultra-low-power high-performance 3-axis accelerometer with digital output for industrial applications

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • IIS2MDC

    High-accuracy, ultra-low-power, 3-axis digital output magnetometer

    厂商 意法半导体封装 LGA-12输入电压 1.71 ~ 3.6 V封装 LGA-12
    1 份文档
  • IIS3DHHC工业级

    High-resolution, high-stability 3-axis digital accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • IRF630

    N-channel 200 V, 0.29 Ω typ., 9 A, STripFET™ Power MOSFET in a TO‑220 package

    厂商 意法半导体封装 TO-220VDS 200 VID 9 A
    1 份文档
  • IRF630FP已停产

    N-channel 200 V, 0.29 Ω typ., 9 A, STripFET™ Power MOSFET in a TO‑220FP package

    厂商 意法半导体封装 TO-220FPVDS 200 VID 9 A
    1 份文档
  • IRF630M已停产

    N-CHANNEL 200V 0.35 OHM 9A TO-220/TO-220FP MESH OVERLAY MOSFET

    厂商 意法半导体封装 TO-220VDS 200 VID 9 A
    1 份文档
  • IRF640已停产

    N-CHANNEL 200V - 0.150 OHM - 18A TO-220/TO-220FP MESH OVERLAY MOSFET

    厂商 意法半导体封装 TO-220VDS 200 VID 18 A
    1 份文档
  • IRF820已停产

    N-channel 500V - 2.5 - 4A - TO-220 PowerMESH™ II MOSFET

    厂商 意法半导体封装 TO-220VDS 500 VID 4 A
    1 份文档
  • ISM303DAC

    untitled

    厂商 意法半导体封装 LGA-12输入电压 1.71 ~ 1.98 V封装 LGA-12
    1 份文档
  • VIPER20A-E

    SMPS primary I.C.

    厂商 意法半导体封装 DIP-8封装 DIP-8
    1 份文档
  • AIS2DW12车规级AEC-Q100

    MEMS digital output motion sensor: ultra-low-power 3-axis accelerometer for automotive applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • AIS2IH车规级AEC-Q100

    MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 115 °C封装 LGA-12
    1 份文档
  • LIS3DH

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • DSILC6-4XX

    ESD Protection for high speed interface

    厂商 意法半导体封装 SOT-666封装 SOT-666
    1 份文档
  • LIS202DL

    MEMS motion sensor 2-axis - ±2g/±8g smart digital output "piccolo" accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS244AL工业级

    MEMS motion sensor: 2-axis - ±2g ultracompact linear accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LIS25BA

    MEMS digital output motion sensor: low-noise, high-bandwidth 3-axis accelerometer with TDM interface

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS2DM

    MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档