“1” 共 21 个型号· 2383 ms

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  • MMA7361LC

    ±1.5g, ±6g Three Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • LY510ALH工业级

    MEMS motion sensor: high performance ±100 °/s analog yaw-rate gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LY5150ALH工业级

    MEMS motion sensor: high performance ±1500 °/s analog yaw-rate gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LPR410AL工业级

    MEMS motion sensor: dual-axis pitch and roll ±100 dps analog gyroscope

    厂商 意法半导体封装 LGA-28工作温度 -40 ~ 85 °C封装 LGA-28
    1 份文档
  • LPR5150AL工业级

    MEMS motion sensor: dual axis pitch and roll ±1500°/s analog gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LPY510AL工业级

    MEMS motion sensor: dual axis pitch and yaw ±100°/s analog gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LPY5150AL工业级

    MEMS motion sensor: dual axis pitch and yaw ±1500°/s analog output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • MC12311

    厂商 恩智浦封装 LGA-60封装 LGA-60
    1 份文档
  • MC1323X

    厂商 恩智浦封装 LGA-48输入电压 1.8 ~ 3.6 V封装 LGA-48
    1 份文档
  • LIS331AL工业级

    MEMS inertial sensor: 3-axis - ±2g analog output "nano" accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • MPL3150A2S工业级

    I²C precision pressure sensor

    厂商 意法半导体封装 LGA-8工作温度 -40 ~ 85 °C封装 LGA-8
    1 份文档
  • MMA7331LC

    ±4g, ±9g Three Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • MMA7341LC

    ±3g, ±9g Three Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • MMA6361L

    ±1.5g, ±6g Two Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • MMA7360L

    ±1.5g, ±6g Three Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • MMA7331L

    16g Three Axis Low-g Micromachined AccelerometerAccelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • MMA7368L

    MMA736L ±1.5g Three Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • STM32WBA5MMG

    Bluetooth® LE and IEEE 802.15.4 radio module

    厂商 意法半导体封装 LGA76封装 LGA76
    1 份文档
  • MMA7330L

    ±4g, ±12g Three Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档
  • MMA7340L

    ±3g, ±11g Three Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 LGA-14封装 LGA-14
    1 份文档