“S” 共 700 个型号· 2570 ms

  • 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs

    厂商 恩智浦封装 LQFP48封装 LQFP48
    1 份文档
  • SC16C554B工业级

    /554DB 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs

    厂商 恩智浦封装 LQFP64工作温度 -40 ~ 85 °C封装 LQFP64
    1 份文档
  • SC16C652B工业级

    5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.) with 32-byte data sheet

    厂商 恩智浦封装 LQFP48工作温度 -40 ~ 85 °C封装 LQFP48
    1 份文档
  • SC16C654B工业级

    /654DB 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.), with 64-byte FIFOs and infrared (IrDA) encoder/decoder

    厂商 恩智浦封装 LQFP64工作温度 -40 ~ 85 °C封装 LQFP64
    1 份文档
  • SC16C752B工业级

    5 V, 2.2 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs data sheet

    厂商 恩智浦封装 LQFP48工作温度 -40 ~ 85 °C封装 LQFP48
    1 份文档
  • SC16C754B工业级

    5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs

    厂商 恩智浦封装 LQFP64工作温度 -40 ~ 85 °C封装 LQFP64
    1 份文档
  • 1.8 V dual UART, 5 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode bus interface

    厂商 恩智浦封装 LQFP48封装 LQFP48
    1 份文档
  • 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs and 68 mode uP interface

    厂商 恩智浦封装 LQFP48封装 LQFP48
    1 份文档
  • SC68C652B工业级

    5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.) with 32-byte FIFOs, IrDA encoder/decoder, and 68 mode uP interface

    厂商 恩智浦封装 LQFP48工作温度 -40 ~ 85 °C封装 LQFP48
    1 份文档
  • SC68C752B工业级

    5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs and 68 mode μP interface

    厂商 恩智浦封装 LQFP48工作温度 -40 ~ 85 °C封装 LQFP48
    1 份文档
  • REGULATING PULSE WIDTH MODULATORS

    厂商 意法半导体封装 DIP16封装 DIP16
    1 份文档
  • Regulating pulse width modulators

    厂商 意法半导体封装 DIP16工作温度 0 ~ 70 °C封装 DIP16
    1 份文档
  • SPC560B40L3工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64工作温度 -40 ~ 125 °CRAM 48 KB
    1 份文档
  • SPC560B64L7工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP100工作温度 -40 ~ 125 °CRAM 96 KB
    1 份文档
  • SPC560D30L3车规级AEC-Q100

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64主频 48 MHzRAM 16 KB
    1 份文档
  • 32-bit Power Architecture® based MCU with 320 KB Flash memory and 20 KB RAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP64主频 64 MHzFlash 320 KB
    1 份文档
  • 32-bit Power Architecture® based MCU with 576 KB Flash memory and 40 KB SRAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP144Flash 576 KBRAM 40 KB
    1 份文档
  • 32-bit Power Architecture® based MCU for automotive powertrain applications

    厂商 意法半导体封装 LQFP144封装 LQFP144
    1 份文档
  • 32-bit Power Architecture® based MCU for automotive powertrain applications

    厂商 意法半导体封装 LQFP176Flash 2 MBRAM 128 KB
    1 份文档
  • 32-bit MCU family built on the embedded Power Architecture®

    厂商 意法半导体封装 LQFP176Flash 4 MBRAM 192 KB
    1 份文档