“3” 共 69 个型号· 8872 ms

排序相关度热度型号 A-Z
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  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS2DM

    MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2DS12工业级

    MEMS digital output motion sensor: ultra-low-power, high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2HH12工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2MDL工业级

    Digital output magnetic sensor: ultralow-power, high-performance 3-axis magnetometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C输入电压 1.71 ~ 3.6 V
    1 份文档
  • LSM6DB0

    iNEMO advanced inertial module: 3D accelerometer, 3D gyroscope and signal processor

    厂商 意法半导体封装 LGA-22封装 LGA-22
    1 份文档
  • LSM9DS0

    iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer

    厂商 意法半导体封装 LGA-24输入电压 2.4 ~ 3.6 V封装 LGA-24
    1 份文档
  • MIS2DH

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档