“S” 共 1,516 个型号· 239 ms

  • STB16NK65Z-S已停产

    N-channel 650V - 0.38Ω- 13A TO-220 / I²SPAK Zener -protected SuperMESH™ MOSFET

    厂商 意法半导体封装 TO-220VDS 650 VID 13 A
    1 份文档
  • XL-density performance line ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

    厂商 意法半导体封装 LQFP64Flash 1 MBRAM 96 KB
    1 份文档
  • Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 com. interfaces

    厂商 意法半导体封装 LQFP64Flash 32 KBRAM 10 KB
    1 份文档
  • N-channel 550 V, 150 mΩ typ., 16 A MDmesh M5 Power MOSFET in a TO-220 package

    厂商 意法半导体封装 TO-220VDS 550 VID 16 A
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  • XL-density access line, ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, 15 timers, 1 ADC and 10 communication interfaces

    厂商 意法半导体封装 LQFP144Flash 1 MBRAM 80 KB
    1 份文档
  • REGULATING PULSE WIDTH MODULATORS

    厂商 意法半导体封装 DIP16封装 DIP16
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  • Regulating pulse width modulators

    厂商 意法半导体封装 DIP16工作温度 0 ~ 70 °C封装 DIP16
    1 份文档
  • SPC560B40L3工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64工作温度 -40 ~ 125 °CRAM 48 KB
    1 份文档
  • SPC560B64L7工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP100工作温度 -40 ~ 125 °CRAM 96 KB
    1 份文档
  • SPC560D30L3车规级AEC-Q100

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64主频 48 MHzRAM 16 KB
    1 份文档
  • 32-bit Power Architecture® based MCU with 320 KB Flash memory and 20 KB RAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP64主频 64 MHzFlash 320 KB
    1 份文档
  • 32-bit Power Architecture® based MCU with 576 KB Flash memory and 40 KB SRAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP144Flash 576 KBRAM 40 KB
    1 份文档
  • 32-bit Power Architecture® based MCU for automotive powertrain applications

    厂商 意法半导体封装 LQFP144封装 LQFP144
    1 份文档
  • 32-bit Power Architecture® based MCU for automotive powertrain applications

    厂商 意法半导体封装 LQFP176Flash 2 MBRAM 128 KB
    1 份文档
  • 32-bit MCU family built on the embedded Power Architecture®

    厂商 意法半导体封装 LQFP176Flash 4 MBRAM 192 KB
    1 份文档
  • SPC564B64L7工业级

    Corporate_Template_Book.book

    厂商 意法半导体封装 LQFP176工作温度 -40 ~ 125 °C封装 LQFP176
    1 份文档
  • SPC564L70L3工业级

    32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications

    厂商 意法半导体封装 LQFP100工作温度 -40 ~ 125 °CFlash 2 MB
    1 份文档
  • SPC56AP60L3工业级

    32-bit Power Architecture® based MCU with 1088KB Flash memory and 80KB RAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP144工作温度 -40 ~ 125 °CFlash 1088 KB
    1 份文档
  • Cool bypass switch for photovoltaic applications

    厂商 意法半导体封装 TO220封装 TO220
    1 份文档
  • Cool bypass switch for photovoltaic applications

    厂商 意法半导体封装 TO220封装 TO220
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