“O” 共 33 个型号· 3 ms

排序相关度热度型号 A-Z
意法半导体 LGA 清除筛选
  • LIS2MDL工业级

    Digital output magnetic sensor: ultralow-power, high-performance 3-axis magnetometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C输入电压 1.71 ~ 3.6 V
    1 份文档
  • AIS2DW12车规级AEC-Q100

    MEMS digital output motion sensor: ultra-low-power 3-axis accelerometer for automotive applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • AIS2IH车规级AEC-Q100

    MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 115 °C封装 LGA-12
    1 份文档
  • LIS3DH

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • LIS25BA

    MEMS digital output motion sensor: low-noise, high-bandwidth 3-axis accelerometer with TDM interface

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS2DM

    MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2DS12工业级

    MEMS digital output motion sensor: ultra-low-power, high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2HH12工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS302DLH工业级

    MEMS digital output motion sensor ultra low-power high performance 3-axes “piccolo” accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS3DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "nano" accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LIS3DSH

    MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • MIS2DH

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • A3G4250D车规级AEC-Q100

    MEMS motion sensor: 3-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • L3G3200D工业级

    MEMS motion sensor: three-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • L3G4200DH工业级

    MEMS motion sensor: three-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • L3G4IS

    MEMS motion sensor: three-axis digital output gyroscope for gaming and OIS

    厂商 意法半导体封装 LGA-16工作温度 -30 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • L3GD20工业级

    MEMS motion sensor: three-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • LIS302ALB

    MEMS motion sensor 3-axis - ±2g analog output "piccolo" accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档