- 1 份文档
- 1 份文档
- 1 份文档
- 1 份文档
- 1 份文档
ARM®-based 32-bit MCU, up to 128 KB Flash, USB FS 2.0, 11 timers, ADC, communication interfaces, 2.4 - 3.6 V
厂商 意法半导体封装 LQFP641 份文档Arm®-based 32-bit MCU, 128 KB Flash, 12 timers, ADC, DAC and comm. interfaces, 2.0 - 3.6 V
厂商 意法半导体封装 LQFP1001 份文档Arm®-based 32-bit MCU, 128 KB Flash, crystal-less USB FS 2.0, 12 timers, ADC, DAC and comm. interfaces, 1.8 V
厂商 意法半导体封装 LQFP1001 份文档ARM®-based 32-bit MCU, up to 256 KB Flash, CAN, 12 timers, ADC, DAC, and comm. interfaces, 2.0 - 3.6V
厂商 意法半导体封装 LQFP1001 份文档ARM® Cortex®-M4 32b MCU+FPU, up to 512KB Flash, 64KB SRAM, FSMC, 2 ADCs, 1 DAC ch., 4 comp, 2 Op-Amp, 2.0-3.6 V
厂商 意法半导体封装 LQFP641 份文档Arm<Sup>® </Sup>Cortex<Sup>®</Sup>-M0+ 32-bit MCU, up to 64 KB Flash, 8 KB RAM, 2x USART, timers, ADC, comm. I/Fs, 2.0-3.6 V
厂商 意法半导体封装 LQFP481 份文档Arm<Sup>® </Sup>Cortex<Sup>®</Sup>-M0+ 32-bit MCU, up to 64 KB Flash, 18 KB RAM, 2x USART, timers, ADC, comm. I/Fs, 2.0-3.6 V
厂商 意法半导体封装 LQFP481 份文档Arm<Sup>® </Sup>Cortex<Sup>®</Sup>-M0+ 32-bit MCU, 128 KB Flash, 36 KB RAM, 4x USART, timers, ADC, comm. I/Fs, 2.0-3.6 V
厂商 意法半导体封装 LQFP641 份文档Arm<Sup>® </Sup>Cortex<Sup>®</Sup>-M0+ 32-bit MCU, 512KB Flash, 144KB RAM, 6x USART, timers, ADC, comm. I/Fs, 2.0-3.6 V
厂商 意法半导体封装 LQFP641 份文档XL-density performance line ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces
厂商 意法半导体封装 LQFP641 份文档Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 com. interfaces
厂商 意法半导体封装 LQFP641 份文档XL-density access line, ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, 15 timers, 1 ADC and 10 communication interfaces
厂商 意法半导体封装 LQFP1441 份文档- SPC560B40L3工业级
32-bit MCU family built on the Power Architecture® for automotive body electronics applications
厂商 意法半导体封装 LQFP641 份文档 - SPC560B64L7工业级
32-bit MCU family built on the Power Architecture® for automotive body electronics applications
厂商 意法半导体封装 LQFP1001 份文档 32-bit MCU family built on the Power Architecture® for automotive body electronics applications
厂商 意法半导体封装 LQFP641 份文档