“F” 共 9 个型号· 165 ms

排序相关度热度型号 A-Z
传感器 LGA 清除筛选
  • L3G462A工业级

    MEMS motion sensor: ± 625 dps full scale - 3-axis analog gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • LSM333D

    iNEMO Intertial Module: 9 degrees of freedom sensing solution

    厂商 意法半导体封装 LGA-28输入电压 2.4 ~ 3.6 V封装 LGA-28
    1 份文档
  • AIS2DW12车规级AEC-Q100

    MEMS digital output motion sensor: ultra-low-power 3-axis accelerometer for automotive applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • AIS2IH车规级AEC-Q100

    MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 115 °C封装 LGA-12
    1 份文档
  • IIS2DH

    Ultra-low-power high-performance 3-axis accelerometer with digital output for industrial applications

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • L3G4IS

    MEMS motion sensor: three-axis digital output gyroscope for gaming and OIS

    厂商 意法半导体封装 LGA-16工作温度 -30 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS2DM

    MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档