“D” 共 44 个型号· 27 ms

排序相关度热度型号 A-Z
传感器 DFN SSOP LGA 清除筛选
  • AIS2DW12车规级AEC-Q100

    MEMS digital output motion sensor: ultra-low-power 3-axis accelerometer for automotive applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DS12工业级

    MEMS digital output motion sensor: ultra-low-power, high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS302DLH工业级

    MEMS digital output motion sensor ultra low-power high performance 3-axes “piccolo” accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS3DSH

    MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • L3GD20工业级

    MEMS motion sensor: three-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • LIS3DHH工业级

    MEMS motion sensor: three-axis digital output accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • IIS3DHHC工业级

    High-resolution, high-stability 3-axis digital accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • ISM303DAC

    untitled

    厂商 意法半导体封装 LGA-12输入电压 1.71 ~ 1.98 V封装 LGA-12
    1 份文档
  • LSM303DLHC

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-14输入电压 2.16 ~ 3.6 V封装 LGA-14
    1 份文档
  • LSM303DLM

    厂商 意法半导体封装 LGA-28输入电压 2.16 ~ 3.6 V封装 LGA-28
    1 份文档
  • LSM6DB0

    iNEMO advanced inertial module: 3D accelerometer, 3D gyroscope and signal processor

    厂商 意法半导体封装 LGA-22封装 LGA-22
    1 份文档
  • LSM9DS0

    iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer

    厂商 意法半导体封装 LGA-24输入电压 2.4 ~ 3.6 V封装 LGA-24
    1 份文档
  • LIS2MDL工业级

    Digital output magnetic sensor: ultralow-power, high-performance 3-axis magnetometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C输入电压 1.71 ~ 3.6 V
    1 份文档
  • AIS2IH车规级AEC-Q100

    MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 115 °C封装 LGA-12
    1 份文档
  • LIS3DH

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • LIS2DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS2DM

    MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2HH12工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS3DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "nano" accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档