“E” 共 6 个型号· 27 ms

排序相关度热度型号 A-Z
传感器 接口芯片 LGA 清除筛选
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LSM303AGR

    Ultracompact high-performance eCompass module: ultralow-power 3-axis accelerometer and 3-axis magnetometer

    厂商 意法半导体封装 LGA-12输入电压 1.71 ~ 3.6 V封装 LGA-12
    1 份文档
  • LSM303C

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-12输入电压 1.9 ~ 3.6 V封装 LGA-12
    1 份文档
  • LSM303D

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-16输入电压 2.16 ~ 3.6 V封装 LGA-16
    1 份文档
  • LSM303DLHC

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-14输入电压 2.16 ~ 3.6 V封装 LGA-14
    1 份文档
  • MPL3150A2S工业级

    I²C precision pressure sensor

    厂商 意法半导体封装 LGA-8工作温度 -40 ~ 85 °C封装 LGA-8
    1 份文档