共 170 个型号· 217 ms

  • AT32F437VGT7工业级国产

    Cortex-M4F 288MHz、1MB Flash、以太网 MAC

    厂商 雅特力封装 LQFP-100内核 ARM Cortex-M4F(带 FPU、DSP、MPU)主频 288MHz
    1 份文档
  • CH32V208WBU6工业级国产

    RISC-V4C 144MHz、BLE 5.3、以太网

    厂商 南京沁恒封装 QFN-68内核 青稞 V4C 32 位 RISC-V(硬件压栈,单周期乘法,硬件除法)主频 144MHz
    1 份文档
  • AT32F435RGT7工业级国产

    Cortex-M4F 288MHz、1MB Flash

    厂商 雅特力封装 LQFP-64内核 ARM Cortex-M4F(带 FPU、DSP、MPU)主频 288MHz
    1 份文档
  • AT32F421C8T7工业级国产

    Cortex-M4 120MHz、64KB Flash 经济型 MCU

    厂商 雅特力封装 LQFP-48内核 ARM Cortex-M4(带 DSP、MPU,无 FPU)主频 120MHz
    1 份文档
  • XL-density performance line ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

    厂商 意法半导体封装 LQFP64Flash 1 MBRAM 96 KB
    1 份文档
  • Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 com. interfaces

    厂商 意法半导体封装 LQFP64Flash 32 KBRAM 10 KB
    1 份文档
  • XL-density access line, ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, 15 timers, 1 ADC and 10 communication interfaces

    厂商 意法半导体封装 LQFP144Flash 1 MBRAM 80 KB
    1 份文档
  • ±1.5g Dual Axis Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
    1 份文档
  • L497已停产

    Hall effect pickup ignition controller

    厂商 意法半导体封装 DIP16封装 DIP16
    1 份文档
  • LIS2L02AQ3工业级

    MEMS inertial sensor: 2-axis - ±2g/±6g linear accelerometer

    厂商 意法半导体封装 QFN-44工作温度 -40 ~ 85 °C封装 QFN-44
    1 份文档
  • LIS3L02AQ3工业级

    MEMS inertial sensor: 3-axis - ±2g/±6g linear accelerometer

    厂商 意法半导体封装 QFN-44工作温度 -40 ~ 85 °C封装 QFN-44
    1 份文档
  • LIS3L02AQ工业级

    Inertial sensor: 3axis - 2g/6g linear accelerometer

    厂商 意法半导体封装 QFN-44工作温度 -40 ~ 85 °C封装 QFN-44
    1 份文档
  • MEMS inertial sensor: 3-axis - ±2g digital output linear accelerometer

    厂商 意法半导体封装 QFN44工作温度 -20 ~ 70 °C封装 QFN44
    1 份文档
  • SPC560B40L3工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64工作温度 -40 ~ 125 °CRAM 48 KB
    1 份文档
  • SPC560B64L7工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP100工作温度 -40 ~ 125 °CRAM 96 KB
    1 份文档
  • SPC560D30L3车规级AEC-Q100

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    厂商 意法半导体封装 LQFP64主频 48 MHzRAM 16 KB
    1 份文档
  • 32-bit Power Architecture® based MCU for automotive powertrain applications

    厂商 意法半导体封装 LQFP144封装 LQFP144
    1 份文档
  • SPC564L70L3工业级

    32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications

    厂商 意法半导体封装 LQFP100工作温度 -40 ~ 125 °CFlash 2 MB
    1 份文档
  • SPC56AP60L3工业级

    32-bit Power Architecture® based MCU with 1088KB Flash memory and 80KB RAM for automotive chassis and safety applications

    厂商 意法半导体封装 LQFP144工作温度 -40 ~ 125 °CFlash 1088 KB
    1 份文档
  • 16-bit MCU with 128 Kbyte Flash memory and 12 Kbyte RAM

    厂商 意法半导体封装 LQFP144封装 LQFP144
    1 份文档