“O” 共 39 个型号· 31 ms

排序相关度热度型号 A-Z
MCU 微控制器 传感器 DFN LGA 清除筛选
  • NCT1008

    ±1°C Temperature Monitor with Series Resistance Cancellation

    厂商 安森美封装 DFN8封装 DFN8
    1 份文档
  • NCT72

    +-1C Temperature Monitor with Series Resistance Cancellation

    厂商 安森美封装 DFN8封装 DFN8
    1 份文档
  • NCV7694

    Safety Controller for Infra-Red LED Illumination to Complement the Image Sensor for Automotive Applications

    厂商 安森美封装 DFN10封装 DFN10
    1 份文档
  • NUS3046MN

    Overvoltage Protection IC

    厂商 安森美封装 DFN8封装 DFN8
    1 份文档
  • LIS2MDL工业级

    Digital output magnetic sensor: ultralow-power, high-performance 3-axis magnetometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C输入电压 1.71 ~ 3.6 V
    1 份文档
  • AIS2DW12车规级AEC-Q100

    MEMS digital output motion sensor: ultra-low-power 3-axis accelerometer for automotive applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • AIS2IH车规级AEC-Q100

    MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 115 °C封装 LGA-12
    1 份文档
  • LIS3DH

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS2DM

    MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2DS12工业级

    MEMS digital output motion sensor: ultra-low-power, high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2HH12工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS302DLH工业级

    MEMS digital output motion sensor ultra low-power high performance 3-axes “piccolo” accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS3DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "nano" accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LIS3DSH

    MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • MIS2DH

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • MMA7660FC

    3-Axis Orientation/Motion Detection Sensor

    厂商 恩智浦封装 DFN-10封装 DFN-10
    1 份文档
  • A3G4250D车规级AEC-Q100

    MEMS motion sensor: 3-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • L3G3200D工业级

    MEMS motion sensor: three-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档