“2” 共 38 个型号· 101 ms

排序相关度热度型号 A-Z
接口芯片 传感器 LGA DIP 清除筛选
  • L2G3IS工业级

    MEMS motion sensor

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • LIS202DL

    MEMS motion sensor 2-axis - ±2g/±8g smart digital output "piccolo" accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS244AL工业级

    MEMS motion sensor: 2-axis - ±2g ultracompact linear accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • LIS2L02AL工业级

    MEMS inertial sensor: 2-axis - +/-2g ultracompact linear accelerometer

    厂商 意法半导体封装 LGA-8工作温度 -40 ~ 85 °C封装 LGA-8
    1 份文档
  • ST232B

    5 V powered multi-channel RS-232 drivers and receivers

    厂商 意法半导体封装 DIP-16输入电压 4.5 ~ 5.5 V封装 DIP-16
    1 份文档
  • LIS332AR

    MEMS motion sensor: 3-axis - ±2 g analog-output ultracompact accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • LIS302ALB

    MEMS motion sensor 3-axis - ±2g analog output "piccolo" accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS302SG

    MEMS motion sensor 3-axis - ±2g analog output "piccolo" accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS3L02AL工业级

    MEMS inertial sensor: 3-axis - +/-2g ultracompact linear accelerometer

    厂商 意法半导体封装 LGA-8工作温度 -40 ~ 85 °C封装 LGA-8
    1 份文档
  • AIS2DW12车规级AEC-Q100

    MEMS digital output motion sensor: ultra-low-power 3-axis accelerometer for automotive applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • AIS2IH车规级AEC-Q100

    MEMS digital output motion sensor: high-performance 3-axis accelerometer for automobile applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 115 °C封装 LGA-12
    1 份文档
  • IIS2DH

    Ultra-low-power high-performance 3-axis accelerometer with digital output for industrial applications

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • IIS2MDC

    High-accuracy, ultra-low-power, 3-axis digital output magnetometer

    厂商 意法半导体封装 LGA-12输入电压 1.71 ~ 3.6 V封装 LGA-12
    1 份文档
  • LIS25BA

    MEMS digital output motion sensor: low-noise, high-bandwidth 3-axis accelerometer with TDM interface

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DE工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS2DM

    MEMS digital output motion sensor: ultra low-power high performance 3-axis “femto” accelerometer

    厂商 意法半导体封装 LGA-14封装 LGA-14
    1 份文档
  • LIS2DS12工业级

    MEMS digital output motion sensor: ultra-low-power, high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2HH12工业级

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2MDL工业级

    Digital output magnetic sensor: ultralow-power, high-performance 3-axis magnetometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C输入电压 1.71 ~ 3.6 V
    1 份文档