D 搜索结果 - 芯片资料

“D” 共 41 个型号· 89 ms

排序相关度热度型号 A-Z

接口芯片 MCU 微控制器传感器 QFN SSOP SOT 清除筛选

DSILC6-4XX
ESD Protection for high speed interface
厂商意法半导体封装 SOT-666封装 SOT-666
1 份文档
TDA8003TS
I²C-bus SIM card interface
厂商恩智浦封装 SSOP24输入电压 1.5 ~ 6 V封装 SSOP24
1 份文档
TDA9850
I2C-bus controlled BTSC stereo/SAP decoder
厂商恩智浦封装 SOT232-1封装 SOT232-1
1 份文档
UDA1344TS
Low-voltage low-power stereo audio CODEC with DSP features
厂商恩智浦封装 SSOP28封装 SSOP28
1 份文档
ST3DV520E已停产
MUX/DEMUX for 4 differential channel LVDS and DDC
厂商意法半导体封装 QFN56输入电压 3 ~ 3.6 V封装 QFN56
1 份文档
ESDALC6V1-5P6
ESD protection for high speed interface
厂商意法半导体封装 SOT666封装 SOT666
1 份文档
ESDAULC6-3BP6
ESD protection for high speed interface
厂商意法半导体封装 SOT-666封装 SOT-666
1 份文档
NX3DV221
High-speed USB 2.0 switch with enable
厂商恩智浦封装 SOT650-2输入电压 2.3 ~ 3.6 V封装 SOT650-2
1 份文档
MC33GD3000车规级AEC-Q100
Three phase field effect transistor predriver
厂商恩智浦封装 SOT684封装 SOT684
1 份文档
MC34GD3000车规级AEC-Q100
Three phase field effect transistor predriver
厂商恩智浦封装 SOT684封装 SOT684
1 份文档
NCP81220
Dual Output 4 & 2 Phase Controller with SVID Interface for Desktop and Notebook CPU Applications
厂商安森美封装 QFN52封装 QFN52
1 份文档
NCP81247
Dual Output 4 & 2 Phase Controller with SVID Interface for Desktop and Notebook CPU Applications
厂商安森美封装 QFN52封装 QFN52
1 份文档
SPIRIT1工业级
Low data rate, low power sub-1GHz transceiver
厂商意法半导体封装 QFN20工作温度 -40 ~ 105 °C封装 QFN20
1 份文档
STM6315工业级
Open drain microprocessor reset
厂商意法半导体封装 SOT143-4工作温度 -40 ~ 125 °C封装 SOT143-4
1 份文档
MMA6231Q
±10g Dual Axis Micromachined Accelerometer
厂商恩智浦封装 QFN-16封装 QFN-16
1 份文档
PXS20工业级
MPC5516 Data Sheet
厂商恩智浦封装 QFN12工作温度 -40 ~ 125 °CFlash 1 MB
1 份文档
CLT03-2Q3
Self powered digital input current limiter
厂商意法半导体封装 SOT23工作温度 -30 ~ 125 °C封装 SOT23
1 份文档
STG3696E
Low voltage dual SPDT switch for USB/audio signal switching with 8 kV ESD protection
厂商意法半导体封装 QFN10封装 QFN10
1 份文档
MMA6260Q
±1.5g Dual Axis Micromachined Accelerometer
厂商恩智浦封装 QFN-16封装 QFN-16
1 份文档
MMA6270QT
6 g Dual Axis Low-g Micromachined Accelerometer
厂商恩智浦封装 QFN-16封装 QFN-16
1 份文档