“D” 共 122 个型号· 34 ms

排序相关度热度型号 A-Z
驱动芯片 传感器 DIP QFN SSOP LGA 清除筛选
  • TD310

    Triple IGBT/MOS driver with current sense

    厂商 意法半导体封装 DIP-16输入电压 4 ~ 16 V封装 DIP-16
    1 份文档
  • TDA7250已停产

    60 W hi-fi dual audio driver

    厂商 意法半导体封装 DIP20输入电压 20 ~ 90 V封装 DIP20
    1 份文档
  • TDE1767已停产

    Interface circuit (relay and lamp driver)

    厂商 意法半导体封装 DIP-8封装 DIP-8
    1 份文档
  • TDA5145TS

    Brushless DC motor drive circuit

    厂商 恩智浦封装 SSOP24输出电流 2 A封装 SSOP24
    1 份文档
  • TDA7073A

    TDA7073AT Dual BTL power driver

    厂商 恩智浦封装 DIP16封装 DIP16
    1 份文档
  • AIS2DW12车规级AEC-Q100

    MEMS digital output motion sensor: ultra-low-power 3-axis accelerometer for automotive applications

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS2DE12

    MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer

    厂商 意法半导体封装 LGA-12封装 LGA-12
    1 份文档
  • LIS2DS12工业级

    MEMS digital output motion sensor: ultra-low-power, high-performance 3-axis "pico" accelerometer

    厂商 意法半导体封装 LGA-12工作温度 -40 ~ 85 °C封装 LGA-12
    1 份文档
  • LIS302DLH工业级

    MEMS digital output motion sensor ultra low-power high performance 3-axes “piccolo” accelerometer

    厂商 意法半导体封装 LGA-14工作温度 -40 ~ 85 °C封装 LGA-14
    1 份文档
  • LIS3DSH

    MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer

    厂商 意法半导体封装 LGA-16封装 LGA-16
    1 份文档
  • STLED325

    I²C interfaced, advanced LED controller/driver with keyscan, standby power management and real time clock (RTC)

    厂商 意法半导体封装 QFN32封装 QFN32
    1 份文档
  • STP08CDC596

    8-bit constant current LED sink driver with full outputs detection

    厂商 意法半导体封装 DIP-16封装 DIP-16
    1 份文档
  • STP08DP05

    Low voltage 8-bit constant current LED sink with full outputs error

    厂商 意法半导体封装 DIP-16封装 DIP-16
    1 份文档
  • L3GD20工业级

    MEMS motion sensor: three-axis digital output gyroscope

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C输入电压 2.4 ~ 3.6 V
    1 份文档
  • LIS3DHH工业级

    MEMS motion sensor: three-axis digital output accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • IIS3DHHC工业级

    High-resolution, high-stability 3-axis digital accelerometer

    厂商 意法半导体封装 LGA-16工作温度 -40 ~ 85 °C封装 LGA-16
    1 份文档
  • ISM303DAC

    untitled

    厂商 意法半导体封装 LGA-12输入电压 1.71 ~ 1.98 V封装 LGA-12
    1 份文档
  • LSM303DLHC

    Ultra-compact high-performance eCompass module: 3D accelerometer and 3D magnetometer

    厂商 意法半导体封装 LGA-14输入电压 2.16 ~ 3.6 V封装 LGA-14
    1 份文档
  • LSM303DLM

    厂商 意法半导体封装 LGA-28输入电压 2.16 ~ 3.6 V封装 LGA-28
    1 份文档
  • LSM6DB0

    iNEMO advanced inertial module: 3D accelerometer, 3D gyroscope and signal processor

    厂商 意法半导体封装 LGA-22封装 LGA-22
    1 份文档