H 搜索结果 - 芯片资料

“H” 共 11 个型号· 109 ms

TSH22
High performance dual bipolar operational amplifier
厂商意法半导体封装 DIP8输入电压 3 ~ 30 V封装 DIP8
1 份文档
TSH24
High performance quad bipolar operational amplifier
厂商意法半导体封装 DIP14输入电压 3 ~ 30 V封装 DIP14
1 份文档
LM219
High-speed dual comparators
厂商意法半导体封装 DIP14封装 DIP14
1 份文档
TS272
HIGH PERFORMANCE CMOS DUAL OP-AMPS
厂商意法半导体封装 DIP8输入电压 3 ~ 16 V封装 DIP8
1 份文档
TS274
High performance CMOS quad operational amplifier
厂商意法半导体封装 DIP14输入电压 3 ~ 16 V封装 DIP14
1 份文档
TS921
Rail-to-rail high output current single operational amplifier
厂商意法半导体封装 DIP8输入电压 2.7 ~ 12 V封装 DIP8
1 份文档
TSM112已停产
3.3V 5V 12V housekeeping IC
厂商意法半导体封装 DIP14工作温度 0 ~ 85 °C封装 DIP14
1 份文档
TSM1121已停产
3.3V 5V 12V housekeeping IC
厂商意法半导体封装 DIP14工作温度 0 ~ 85 °C封装 DIP14
1 份文档
TSM114已停产
3.3V 5V ±12V housekeeping IC
厂商意法半导体封装 DIP-14封装 DIP-14
1 份文档
TDA7469已停产
Low voltage analog audio processor with headphone power amplifier
厂商意法半导体封装 SSOP24工作温度 0 ~ 70 °C封装 SSOP24
1 份文档
UDA1341TS
Economy audio CODEC for MiniDisc (MD) home stereo and portable applications
厂商恩智浦封装 SSOP28封装 SSOP28
1 份文档