“A” 共 57 个型号· 23 ms

  • TDA7469已停产

    Low voltage analog audio processor with headphone power amplifier

    厂商 意法半导体封装 SSOP24工作温度 0 ~ 70 °C封装 SSOP24
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  • 2 × 0.7 W BTL audio amplifier

    厂商 恩智浦封装 SSOP20封装 SSOP20
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  • 2 × 0.7 W BTL audio amplifier with output channel switching

    厂商 恩智浦封装 SSOP20封装 SSOP20
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  • Economy audio CODEC for MiniDisc (MD) home stereo and portable applications

    厂商 恩智浦封装 SSOP28封装 SSOP28
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  • Economy audio CODEC

    厂商 恩智浦封装 SSOP28封装 SSOP28
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  • 96 kHz sampling 24-bit stereo audio ADC

    厂商 恩智浦封装 SSOP16封装 SSOP16
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  • 3-axis, 10-bit/8-bit digital accelerometer, Data sheet

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • LIS2L02AQ3工业级

    MEMS inertial sensor: 2-axis - ±2g/±6g linear accelerometer

    厂商 意法半导体封装 QFN-44工作温度 -40 ~ 85 °C封装 QFN-44
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  • LIS3L02AQ3工业级

    MEMS inertial sensor: 3-axis - ±2g/±6g linear accelerometer

    厂商 意法半导体封装 QFN-44工作温度 -40 ~ 85 °C封装 QFN-44
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  • LIS3L02AQ5工业级

    MEMS INERTIAL SENSOR: 3-axis - ±2g/±6g LINEAR ACCELEROMETER

    厂商 意法半导体封装 QFN-44工作温度 -40 ~ 85 °C封装 QFN-44
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  • ±10g Dual Axis Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • ±1.5g Dual Axis Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • 6 g Dual Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • 10g Two Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • 6 g Dual Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • 10g Two Axis Low-g Micromachined Accelerometer

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • 6g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • 10g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    厂商 恩智浦封装 QFN-16封装 QFN-16
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  • Low power audio DAC with PLL

    厂商 恩智浦封装 SSOP16封装 SSOP16
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  • Low power audio DAC

    厂商 恩智浦封装 SSOP16封装 SSOP16
    1 份文档