意法半导体

High-density performance line ARM®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

Value-line ARM®-based 32-bit MCU with up to 256-KB Flash, timers, ADC, communication interfaces, 2.4-3.6 V operation

Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces

Value-line ARM-based 32-bit MCU with 16 to 64-KB Flash, timers, ADC, communication interfaces, 2.4-3.6 V operation

ARM®-based 32-bit MCU, up to 128 KB Flash, crystal-less USB FS 2.0, CAN, 12 timers, ADC, DAC & comm. interfaces, 2.0 - 3.6 V

Connectivity line, ARM®-based 32-bit MCU with 64/256 KB Flash, USB OTG, Ethernet, 10 timers, 2 CANs, 2 ADCs, 14 communication interfaces

Arm®Cortex®-M4 32b MCU+FPU,up to 64KB Flash,16KB SRAM, 2 ADCs,3 DACs,3 comp.,op-amp, 217ps 10-ch (HRTIM1)

Arm®Cortex®-M4 32b MCU+FPU,up to 64KB Flash,16KB SRAM, 2 ADCs,3 DACs,3 comp.,op-amp, 217ps 10-ch (HRTIM1)

ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera

MEMS automotive acceleration sensor: single/dual-axis with SPI interface

XL-density performance line ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

High speed switches

ACEPACK™ 2 converter inverter brake, 1200 V, 35 A, trench gate field‑stop M series IGBT with soft diode and NTC

ACEPACK™ 2 sixpack topology, 1200 V, 75 A trench gate field-stop IGBT M series, soft diode and NTC

Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 com. interfaces

Medium-density performance line Arm<Sup>®</Sup>-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces