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STMicroelectronics

收录 6,336 个型号原厂官网

共 141 个型号· 52 ms

  • XL-density performance line ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

    封装 LQFP64Flash 1 MBRAM 96 KB
    1 份文档
  • Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 com. interfaces

    封装 LQFP64Flash 32 KBRAM 10 KB
    1 份文档
  • Low speed USB 8-BIT MCU with 3 endpoints, Flash or ROM memory, LVD, WDG, 10-bit ADC, 2 timers, SCI, SPI

    封装 PDIP32工作温度 0 ~ 70 °C封装 PDIP32
    1 份文档
  • XL-density access line, ARM®-based 32-bit MCU with 768 KB to 1 MB Flash, 15 timers, 1 ADC and 10 communication interfaces

    封装 LQFP144Flash 1 MBRAM 80 KB
    1 份文档
  • 8-Kbit serial SPI bus EEPROM - 105 °C Operation

    封装 DFN8封装 DFN8
    1 份文档
  • 8-bit MCUs with A/D converter, safe reset, auto-reload timer and EEPROM

    封装 PDIP16封装 PDIP16
    1 份文档
  • STTS424E02不推荐新设计工业级

    Memory module temperature sensor with a 2 Kb SPD EEPROM

    封装 DFN8工作温度 -40 ~ 125 °C输入电压 2.7 ~ 3.6 V
    1 份文档
  • 105 °C Operation

    封装 DFN8封装 DFN8
    1 份文档
  • 128-Kbit serial SPI bus EEPROM - 105 °C operation

    封装 DFN8封装 DFN8
    1 份文档
  • 16-Kbit serial SPI bus EEPROM - 105 °C Operation

    封装 DFN8封装 DFN8
    1 份文档
  • 32-Kbit serial SPI bus EEPROM -105 °C Operation

    封装 DFN8封装 DFN8
    1 份文档
  • SPC560B40L3工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    封装 LQFP64工作温度 -40 ~ 125 °CRAM 48 KB
    1 份文档
  • SPC560B64L7工业级

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    封装 LQFP100工作温度 -40 ~ 125 °CRAM 96 KB
    1 份文档
  • SPC560D30L3车规级AEC-Q100

    32-bit MCU family built on the Power Architecture® for automotive body electronics applications

    封装 LQFP64主频 48 MHzRAM 16 KB
    1 份文档
  • 32-bit Power Architecture® based MCU for automotive powertrain applications

    封装 LQFP144封装 LQFP144
    1 份文档
  • SPC564L70L3工业级

    32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and safety applications

    封装 LQFP100工作温度 -40 ~ 125 °CFlash 2 MB
    1 份文档
  • SPC56AP60L3工业级

    32-bit Power Architecture® based MCU with 1088KB Flash memory and 80KB RAM for automotive chassis and safety applications

    封装 LQFP144工作温度 -40 ~ 125 °CFlash 1088 KB
    1 份文档
  • 16-bit MCU with 128 Kbyte Flash memory and 12 Kbyte RAM

    封装 LQFP144封装 LQFP144
    1 份文档
  • 16-bit MCU with 256 Kbyte Flash memory and 12/20 Kbyte RAM

    封装 LQFP144封装 LQFP144
    1 份文档
  • 16-bit MCU with MAC unit, 832 Kbyte Flash memory and 68 Kbyte RAM

    封装 LQFP144封装 LQFP144
    1 份文档