恩智浦

NXP

收录 4,293 个型号原厂官网

共 136 个型号· 3721 ms

  • SC18IS604工业级

    SPI to I2C-bus bridge

    封装 TSSOP16工作温度 -40 ~ 105 °C封装 TSSOP16
    1 份文档
  • SC33690DS工业级

    MC33690DS.fm

    封装 SOIC-20工作温度 -40 ~ 125 °C封装 SOIC-20
    1 份文档
  • 14-bit SSTL_2 registered driver with differential clock inputs

    封装 TSSOP-48封装 TSSOP-48
    1 份文档
  • DDR PC1600-PC3200 14-bit SSTL_2 registered driver with differential clock inputs

    封装 TSSOP-48封装 TSSOP-48
    1 份文档
  • Light position controller

    封装 DIP8封装 DIP8
    1 份文档
  • Mono BTL audio amplifier with DC volume control

    封装 DIP8输入电压 4.5 ~ 18 V封装 DIP8
    1 份文档
  • Stereo BTL audio output amplifier with DC volume control

    封装 DIP16输入电压 4.5 ~ 18 V封装 DIP16
    1 份文档
  • TDA7073AT Dual BTL power driver

    封装 DIP16封装 DIP16
    1 份文档
  • Low power IC card interface

    封装 TSSOP28输入电压 2.7 ~ 6.5 V封装 TSSOP28
    1 份文档
  • 1.5 W mono Bridge Tied Load (BTL) audio amplifier

    封装 DIP8封装 DIP8
    1 份文档
  • SMPS ICs for low-power systems

    封装 DIP8封装 DIP8
    1 份文档
  • Half-bridge power IC for CFL lamps

    封装 DIP8封装 DIP8
    1 份文档
  • UBA2080A; UBA2081 Half-bridge driver IC

    封装 DIP8封装 DIP8
    1 份文档
  • Half-bridge power IC family for CFL lamps

    封装 DIP8封装 DIP8
    1 份文档
  • Half-bridge power IC family for CFL lamps

    封装 DIP14封装 DIP14
    1 份文档
  • Half-bridge power IC family for CFL lamps

    封装 DIP8封装 DIP8
    1 份文档