恩智浦

NXP

收录 4,586 个型号原厂官网

共 15 个型号· 439 ms

排序默认热度型号 A-Z
接口芯片 MEMS 运动传感器 QFN SSOP 清除筛选
  • MMA6260Q

    ±1.5g Dual Axis Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • FXLN83XXQ工业级

    Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer

    封装 QFN-12工作温度 -40 ~ 105 °C封装 QFN-12
    1 份文档
  • MC13883

    Integrated Charger USB Interface

    封装 QFN-40封装 QFN-40
    1 份文档
  • MMA6270QT

    6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • MMA6271QT

    10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • MMA6280QT

    6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • MMA6281QT

    10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • PCF8575C

    Remote 16-bit I/O expander for I2C-bus

    封装 SSOP24输入电压 4.5 ~ 5.5 V封装 SSOP24
    1 份文档
  • MMA7260QT

    6g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • MMA8453Q

    3-axis, 10-bit/8-bit digital accelerometer, Data sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • PCF8575

    Remote 16-bit I/O expander for I 2 C-bus

    封装 SSOP24输入电压 2.5 ~ 5.5 V封装 SSOP24
    1 份文档
  • TDA8003TS

    I²C-bus SIM card interface

    封装 SSOP24输入电压 1.5 ~ 6 V封装 SSOP24
    1 份文档
  • MC44BS373CA

    封装 QFN20封装 QFN20
    1 份文档
  • MMA6231Q

    ±10g Dual Axis Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • MMA7261QT

    10g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    封装 QFN-16封装 QFN-16
    1 份文档