恩智浦

NXP

收录 4,586 个型号原厂官网

共 35 个型号· 2 ms

  • ±1.5g Dual Axis Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • FXLN83XXQ工业级

    Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer

    封装 QFN-12工作温度 -40 ~ 105 °C封装 QFN-12
    1 份文档
  • Integrated Charger USB Interface

    封装 QFN-40封装 QFN-40
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • ±4g, ±12g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±3g, ±11g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±3g, ±9g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • 6g Three Axis Low-g Micromachined AccelerometerAccelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • MMA736L ±1.5g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±2g/±4g/±8g Three Axis Low-g Digital Output Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • MPC5510 Microcontroller Family Data Sheet

    封装 QFN12RAM 80 KB封装 QFN12
    1 份文档
  • MPC5643L工业级

    Microcontroller

    封装 QFN12工作温度 -40 ~ 125 °CFlash 1 MB
    1 份文档
  • Remote 16-bit I/O expander for I2C-bus

    封装 SSOP24输入电压 4.5 ~ 5.5 V封装 SSOP24
    1 份文档
  • ±4g, ±9g Two Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • 6g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • MMA72341L ±3g, ±11g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±1.5g, ±6g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档