恩智浦

NXP

收录 4,586 个型号原厂官网

共 31 个型号· 3 ms

  • Tri-Band Low Noise Amplifiers with Bypass Switches Data Sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • ±1.5g Dual Axis Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • Ultra low power, 1.8 V, 1 deg. C accuracy, digital temperature sensor with I2C-bus interface

    封装 WLCSP6封装 WLCSP6
    1 份文档
  • FXLN83XXQ工业级

    Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer

    封装 QFN-12工作温度 -40 ~ 105 °C封装 QFN-12
    1 份文档
  • 2.4 GHz Low Power Transceiver for the IEEE® 802.15.4 Standard

    封装 QFN-32封装 QFN-32
    1 份文档
  • 封装 QFN-12封装 QFN-12
    1 份文档
  • Integrated Charger USB Interface

    封装 QFN-40封装 QFN-40
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • NX20P0407工业级

    USB Type-C CC and SBU Protection IC

    封装 WLCSP12工作温度 -40 ~ 85 °C封装 WLCSP12
    1 份文档
  • Remote 16-bit I/O expander for I2C-bus

    封装 SSOP24输入电压 4.5 ~ 5.5 V封装 SSOP24
    1 份文档
  • Dual-band 1x1 Wi-Fi 4 and Bluetooth Combo SoC

    封装 WLCSP76工作温度 0 ~ 70 °C封装 WLCSP76
    1 份文档
  • /MC13203 2.4 GHz Low Power Transceiver for the IEEE® 802.15.4 Standard

    封装 QFN-32封装 QFN-32
    1 份文档
  • 6g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • 3-axis, 10-bit/8-bit digital accelerometer, Data sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • NX20P3483AUK工业级

    USB PD and Type-C high voltage sink/source combo switch with protection data sheet

    封装 WLCSP42工作温度 -40 ~ 85 °C封装 WLCSP42
    1 份文档
  • USB PD and Type-C high voltage sink/source combo switch

    封装 WLCSP42封装 WLCSP42
    1 份文档
  • P3T1035XUK工业级

    I3C, I2C-Bus, 0.5 °C Accuracy, Digital Temperature Sensor

    封装 WLCSP4工作温度 -40 ~ 125 °C封装 WLCSP4
    1 份文档