恩智浦

NXP

收录 4,293 个型号原厂官网

共 38 个型号· 2 ms

  • ±1.5g Dual Axis Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • FXLN83XXQ工业级

    Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer

    封装 QFN-12工作温度 -40 ~ 105 °C封装 QFN-12
    1 份文档
  • Integrated Charger USB Interface

    封装 QFN-40封装 QFN-40
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • ±4g, ±12g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±3g, ±11g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±3g, ±9g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • 6g Three Axis Low-g Micromachined AccelerometerAccelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • MMA736L ±1.5g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±2g/±4g/±8g Three Axis Low-g Digital Output Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • HECETA4 Temperature and voltage monitor

    封装 SSOP16工作温度 0 ~ 125 °C封装 SSOP16
    1 份文档
  • Parallel bus to I2C-bus controller

    封装 DIP20输入电压 2.3 ~ 3.6 V封装 DIP20
    1 份文档
  • 256 x 8-bit static low-voltage RAM with I²C-bus interface

    封装 DIP8输入电压 2.5 ~ 6 V封装 DIP8
    1 份文档
  • Remote 16-bit I/O expander for I2C-bus

    封装 SSOP24输入电压 4.5 ~ 5.5 V封装 SSOP24
    1 份文档
  • Half-bridge power IC family for CFL lamps

    封装 DIP14封装 DIP14
    1 份文档
  • Half-bridge power IC family for CFL lamps

    封装 DIP8封装 DIP8
    1 份文档
  • Multiple Channel DC-DC Power Management IC

    封装 QFN56封装 QFN56
    1 份文档