恩智浦

NXP

收录 4,293 个型号原厂官网

共 59 个型号· 2919 ms

  • FXLN83XXQ工业级

    Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer

    封装 QFN-12工作温度 -40 ~ 105 °C封装 QFN-12
    1 份文档
  • Integrated Charger USB Interface

    封装 QFN-40封装 QFN-40
    1 份文档
  • Multiple Channel DC-DC Power Management IC

    封装 QFN56封装 QFN56
    1 份文档
  • 封装 QFN20封装 QFN20
    1 份文档
  • ±10g Dual Axis Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • ±1.5g Dual Axis Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 6 g Dual Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Two Axis Low-g Micromachined Accelerometer

    封装 QFN-16封装 QFN-16
    1 份文档
  • 6g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • 10g Three Axis Low-g Micromachined Accelerometer - Data Sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • 3-axis, 10-bit/8-bit digital accelerometer, Data sheet

    封装 QFN-16封装 QFN-16
    1 份文档
  • MPC5510 Microcontroller Family Data Sheet

    封装 QFN12RAM 80 KB封装 QFN12
    1 份文档
  • MPC5643L工业级

    Microcontroller

    封装 QFN12工作温度 -40 ~ 125 °CFlash 1 MB
    1 份文档
  • Microcontroller

    封装 QFN12封装 QFN12
    1 份文档
  • HECETA4 Temperature and voltage monitor

    封装 SSOP16工作温度 0 ~ 125 °C封装 SSOP16
    1 份文档
  • Bidirectional high-side power switch for charger and USB-OTG combined applications

    封装 WLCSP12输入电压 3.2 ~ 17.5 V封装 WLCSP12
    1 份文档
  • NX20P0407工业级

    USB Type-C CC and SBU Protection IC

    封装 WLCSP12工作温度 -40 ~ 85 °C封装 WLCSP12
    1 份文档
  • NX20P0408工业级

    USB D+/D- protection IC

    封装 WLCSP12工作温度 -40 ~ 85 °C封装 WLCSP12
    1 份文档