恩智浦

NXP

收录 4,586 个型号原厂官网

共 37 个型号· 275 ms

  • Ultra low power, 1.8 V, 1 deg. C accuracy, digital temperature sensor with I2C-bus interface

    封装 WLCSP6封装 WLCSP6
    1 份文档
  • ±4g, ±12g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±3g, ±11g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±3g, ±9g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • 6g Three Axis Low-g Micromachined AccelerometerAccelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • MMA736L ±1.5g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±2g/±4g/±8g Three Axis Low-g Digital Output Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • NX20P0407工业级

    USB Type-C CC and SBU Protection IC

    封装 WLCSP12工作温度 -40 ~ 85 °C封装 WLCSP12
    1 份文档
  • Remote 16-bit I/O expander for I2C-bus

    封装 SSOP24输入电压 4.5 ~ 5.5 V封装 SSOP24
    1 份文档
  • 1.2 W/channel stereo class-D audio amplifier

    封装 WLCSP16输入电压 2.5 ~ 5.5 V封装 WLCSP16
    1 份文档
  • 2 × 0.7 W BTL audio amplifier

    封装 SSOP20封装 SSOP20
    1 份文档
  • 3.4 W PDM input class-D audio amplifier

    封装 WLCSP9封装 WLCSP9
    1 份文档
  • Low-cost stereo filter DAC

    封装 SSOP16输入电压 2.7 ~ 5.5 V封装 SSOP16
    1 份文档
  • Low power audio DAC with PLL

    封装 SSOP16封装 SSOP16
    1 份文档
  • Low power audio DAC

    封装 SSOP16封装 SSOP16
    1 份文档
  • Economy audio CODEC

    封装 SSOP28封装 SSOP28
    1 份文档
  • ±4g, ±9g Two Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • MMA72341L ±3g, ±11g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±1.5g, ±6g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档
  • ±1.5g, ±6g Three Axis Low-g Micromachined Accelerometer

    封装 LGA-14封装 LGA-14
    1 份文档