射频 / 无线

共 1,424 个型号

共 57 个型号· 30 ms

排序默认热度型号 A-Z

LQFP QFN BGA 清除筛选

BAL-NRF01D3
50 nominal input / conjugate match balun to nRF24LE1 & nRF51822-QFAA, with integrated harmonic filter
厂商意法半导体封装 QFN32封装 QFN32
1 份文档
ST25R3914车规级AEC-Q100
Automotive high performance HF reader / NFC initiator with 1 W output power supporting AAT
厂商意法半导体封装 QFN32工作温度 -40 ~ 125 °C输入电压 2.4 ~ 5.5 V
1 份文档
ST25RU3993工业级
RAIN® RFID single chip reader EPC Class1 Gen2 compatible
厂商意法半导体封装 QFN48工作温度 -40 ~ 85 °C输入电压 3 ~ 3.6 V
1 份文档
STA5620已停产
Fully integrated RF front-end receiver for GPS applications
厂商意法半导体封装 QFN-32封装 QFN-32
1 份文档
STA5620C
Fully integrated RF front-end receiver for GPS applications
厂商意法半导体封装 QFN-32封装 QFN-32
1 份文档
STB5610已停产
GPS RF front-end IC
厂商意法半导体封装 LQFP48封装 LQFP48
1 份文档
RSL15
Bluetooth® 5.2 Wireless MCU
厂商安森美封装 QFN40封装 QFN40
1 份文档
BGA2001
Silicon MMIC amplifier
厂商恩智浦封装 BGA2001封装 BGA2001
1 份文档
BGA2002车规级AEC-Q100
MMIC amplifier
厂商恩智浦封装 BGA2002封装 BGA2002
1 份文档
BGA2003
Silicon MMIC amplifier
厂商恩智浦封装 BGA2003封装 BGA2003
1 份文档
BGA2011
900 MHz high linear low noise amplifier
厂商恩智浦封装 BGA2011封装 BGA2011
1 份文档
BGA2012
1900 MHz high linear low noise amplifier
厂商恩智浦封装 BGA2012封装 BGA2012
1 份文档
BGA2022
MMIC mixer
厂商恩智浦封装 BGA2022封装 BGA2022
1 份文档
BGA2031
/1 MMIC variable gain amplifier
厂商恩智浦封装 BGA2031封装 BGA2031
1 份文档
BGA2709
MMIC wideband amplifier
厂商恩智浦封装 BGA2709封装 BGA2709
1 份文档
BGA2711
MMIC wideband amplifier
厂商恩智浦封装 BGA2711封装 BGA2711
1 份文档
BGA2712
MMIC wideband amplifier
厂商恩智浦封装 BGA2712封装 BGA2712
1 份文档
BGA2714
MMIC wideband amplifier
厂商恩智浦封装 BGA2714封装 BGA2714
1 份文档
BGA2715
MMIC wideband amplifier
厂商恩智浦封装 BGA2715封装 BGA2715
1 份文档
BGA2716
MMIC wideband amplifier
厂商恩智浦封装 BGA2716封装 BGA2716
1 份文档