射频 / 无线

共 1,424 个型号

共 14 个型号· 125 ms

排序默认热度型号 A-Z

TQFP WLCSP 进口清除筛选

ST25R3916工业级
High performance NFC universal device and EMVCo reader
厂商意法半导体封装 WLCSP36工作温度 -40 ~ 105 °C封装 WLCSP36
1 份文档
ST25R3916B工业级
NFC reader for payment, consumer and industrial applications
厂商意法半导体封装 WLCSP36工作温度 -40 ~ 105 °C封装 WLCSP36
1 份文档
STA8090WG
Fully Integrated GPS/Galileo/Glonass/QZSS receiver with embedded RF
厂商意法半导体封装 WLCSP77封装 WLCSP77
1 份文档
STA8090WGR
Datasheet- DS12835- GPS/Glonass/BeiDou2/QZSS ROM receiver
厂商意法半导体封装 WLCSP77封装 WLCSP77
1 份文档
STB5600已停产
GPS RF front-end IC
厂商意法半导体封装 TQFP32封装 TQFP32
1 份文档
STM32WB15CC
Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.4 radio solution
厂商意法半导体封装 WLCSP49封装 WLCSP49
1 份文档
STM32WB55CC
Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.4 and 802.15.4 radio solution
厂商意法半导体封装 WLCSP100封装 WLCSP100
1 份文档
STM32WBA52CE
Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M33 with TrustZone®, FPU, Bluetooth® LE and IEEE 802.15.4 radio solution
厂商意法半导体封装 WLCSP41封装 WLCSP41
1 份文档
STM32WBA62CI
Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M33 with TrustZone®, FPU, Bluetooth® LE, IEEE802.15.4 radio solution
厂商意法半导体封装 WLCSP88封装 WLCSP88
1 份文档
NCP6360
Mini Buck Converter for RF Power Amplifiers
厂商安森美封装 WLCSP6输入电压 2.7 ~ 5.5 V封装 WLCSP6
1 份文档
NCP6361
厂商安森美封装 WLCSP9输入电压 2.5 ~ 5.5 V封装 WLCSP9
1 份文档
RSL10
Bluetooth® 5.2 Radio System-on-Chip (SoC)
厂商安森美封装 WLCSP51输入电压 1.1 ~ 3.3 V封装 WLCSP51
1 份文档
RSL20
Ultra‐low Power Radio for Hearing Aids and Earbuds
厂商安森美封装 WLCSP62封装 WLCSP62
1 份文档
IW416
Dual-band 1x1 Wi-Fi 4 and Bluetooth Combo SoC
厂商恩智浦封装 WLCSP76工作温度 0 ~ 70 °C封装 WLCSP76
1 份文档