负载开关 / 高边开关

共 468 个型号

共 32 个型号· 1932 ms

排序默认热度型号 A-Z

QFN TSSOP SOT DIP DFN 清除筛选

L6385E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6386E
High voltage high and low-side driver
厂商意法半导体封装 DIP-14封装 DIP-14
1 份文档
L6387E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6388已停产
High-voltage high and low side driver
厂商意法半导体封装 DIP8封装 DIP8
1 份文档
L6388E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
STEF033工业级
Electronic fuse for 3.3 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF05L工业级
Electronic fuse for 5 V line -
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF12工业级
Electronic fuse for 12 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF12E工业级
Electronic fuse for 12 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF512PUR
Dual electronic fuse (eFuse) for 5 V and 12 V rails
厂商意法半导体封装 QFN10封装 QFN10
1 份文档
STEF512SRDB
Dual eFuse for 5 V and 12 V rails
厂商意法半导体封装 DFN10输出电流 10 mA封装 DFN10
1 份文档
STMEC001已停产
Power switch for ExpressCard™
厂商意法半导体封装 QFN16封装 QFN16
1 份文档
STMPS2141工业级
STMPS21x1.fm
厂商意法半导体封装 SOT23工作温度 -40 ~ 85 °C封装 SOT23
1 份文档
STODD03
Monolithic 2-channel power management for high-definition ODD with integrated power switch
厂商意法半导体封装 QFN16输出电流 700 mA封装 QFN16
1 份文档
VND3NV04
OMNIFET II: fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VND7NV04
OMNIFET II fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNL5050N3-E车规级
OMNIFET III fully protected low-side driver
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNL5090N3-E车规级AEC-Q100
DS8791_REV10_MAR02.pdf
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNL5160N3-E车规级
OMNIFET III fully protected low-side driver
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNN1NV04P-E
OMNIFET II fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档