负载开关 / 高边开关

共 468 个型号

共 43 个型号· 3 ms

排序默认热度型号 A-Z

DIP WLCSP SSOP DFN TO 清除筛选

L6385E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6386E
High voltage high and low-side driver
厂商意法半导体封装 DIP-14封装 DIP-14
1 份文档
L6387E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6388已停产
High-voltage high and low side driver
厂商意法半导体封装 DIP8封装 DIP8
1 份文档
L6388E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
STEF033工业级
Electronic fuse for 3.3 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF05L工业级
Electronic fuse for 5 V line -
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF12工业级
Electronic fuse for 12 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
VNP10N06
"Omnifet": fully autoprotected Power MOSFET
厂商意法半导体封装 TO-220封装 TO-220
1 份文档
VNP14N04已停产
"Omnifet": fully autoprotected Power MOSFET
厂商意法半导体封装 TO-220封装 TO-220
1 份文档
VNP35N07-E车规级
OMNIFET: fully autoprotected Power MOSFET
厂商意法半导体封装 TO-220封装 TO-220
1 份文档
VNP35N07已停产
"Omnifet": fully autoprotected Power MOSFET
厂商意法半导体封装 TO-220封装 TO-220
1 份文档
VNP5N07
"Omnifet": fully autoprotected Power MOSFET
厂商意法半导体封装 TO-220封装 TO-220
1 份文档
NX18P3001
Bidirectional high-side power switch for charger and USB-OTG combined applications
厂商恩智浦封装 WLCSP12输入电压 3.2 ~ 17.5 V封装 WLCSP12
1 份文档
NX20P5090
High voltage USB PD power switch
厂商恩智浦封装 WLCSP15输入电压 2.5 ~ 20 V封装 WLCSP15
1 份文档
NX5P2924B车规级AEC-Q100
Logic controlled high-side power switch
厂商恩智浦封装 WLCSP6输入电压 0.8 ~ 5.5 V封装 WLCSP6
1 份文档
NX5P2924D车规级AEC-Q100
Logic controlled high-side power switch
厂商恩智浦封装 WLCSP6工作温度 -40 ~ 85 °C输入电压 0.8 ~ 5.5 V
1 份文档
NX5P3001
Bidirectional high-side power switch for charger and USB-OTG data sheet
厂商恩智浦封装 WLCSP12输入电压 3.2 ~ 6.35 V封装 WLCSP12
1 份文档
STEF12E工业级
Electronic fuse for 12 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF512SRDB
Dual eFuse for 5 V and 12 V rails
厂商意法半导体封装 DFN10输出电流 10 mA封装 DFN10
1 份文档