负载开关 / 高边开关

共 468 个型号

共 33 个型号· 1 ms

排序默认热度型号 A-Z

DFN DIP SSOP QFN WLCSP 清除筛选

L6385E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6386E
High voltage high and low-side driver
厂商意法半导体封装 DIP-14封装 DIP-14
1 份文档
L6387E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6388已停产
High-voltage high and low side driver
厂商意法半导体封装 DIP8封装 DIP8
1 份文档
L6388E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
STEF033工业级
Electronic fuse for 3.3 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF05L工业级
Electronic fuse for 5 V line -
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF12工业级
Electronic fuse for 12 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF12E工业级
Electronic fuse for 12 V line
厂商意法半导体封装 DFN10工作温度 -40 ~ 125 °C封装 DFN10
1 份文档
STEF512PUR
Dual electronic fuse (eFuse) for 5 V and 12 V rails
厂商意法半导体封装 QFN10封装 QFN10
1 份文档
STEF512SRDB
Dual eFuse for 5 V and 12 V rails
厂商意法半导体封装 DFN10输出电流 10 mA封装 DFN10
1 份文档
STMEC001已停产
Power switch for ExpressCard™
厂商意法半导体封装 QFN16封装 QFN16
1 份文档
STODD03
Monolithic 2-channel power management for high-definition ODD with integrated power switch
厂商意法半导体封装 QFN16输出电流 700 mA封装 QFN16
1 份文档
NCP81295工业级
Hot Swap Smart Fuse
厂商安森美封装 QFN32工作温度 -40 ~ 125 °C输入电压 4.5 ~ 18 V
1 份文档
NCV7608
Octal Configurable Low/High Side Driver
厂商安森美封装 SSOP36封装 SSOP36
1 份文档
NCV7755
Octal High-Side Driver
厂商安森美封装 SSOP24输出电流 700 mA封装 SSOP24
1 份文档
NCV8402
NCV8402, NCV8402A - Self-Protected Low Side Driver with Temperature and Current Limit
厂商安森美封装 DFN6封装 DFN6
1 份文档
NX18P3001
Bidirectional high-side power switch for charger and USB-OTG combined applications
厂商恩智浦封装 WLCSP12输入电压 3.2 ~ 17.5 V封装 WLCSP12
1 份文档
NX20P5090
High voltage USB PD power switch
厂商恩智浦封装 WLCSP15输入电压 2.5 ~ 20 V封装 WLCSP15
1 份文档
NX30P0121UK工业级
High-voltage back-to-back OVP switch
厂商恩智浦封装 WLCSP12工作温度 -40 ~ 85 °C输入电压 2.5 ~ 20 V
1 份文档