负载开关 / 高边开关

共 468 个型号

共 31 个型号· 12 ms

排序默认热度型号 A-Z

恩智浦意法半导体 DIP SSOP SOT WLCSP 清除筛选

L6385E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6386E
High voltage high and low-side driver
厂商意法半导体封装 DIP-14封装 DIP-14
1 份文档
L6387E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6388已停产
High-voltage high and low side driver
厂商意法半导体封装 DIP8封装 DIP8
1 份文档
L6388E
High voltage high and low-side driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
STMPS2141工业级
STMPS21x1.fm
厂商意法半导体封装 SOT23工作温度 -40 ~ 85 °C封装 SOT23
1 份文档
VND3NV04
OMNIFET II: fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VND7NV04
OMNIFET II fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNL5050N3-E车规级
OMNIFET III fully protected low-side driver
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNL5090N3-E车规级AEC-Q100
DS8791_REV10_MAR02.pdf
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNL5160N3-E车规级
OMNIFET III fully protected low-side driver
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNN1NV04P-E
OMNIFET II fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNN3NV04P-E
OMNIFET II fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
VNN7NV04P-E
OMNIFET II fully autoprotected Power MOSFET
厂商意法半导体封装 SOT-223封装 SOT-223
1 份文档
NX18P3001
Bidirectional high-side power switch for charger and USB-OTG combined applications
厂商恩智浦封装 WLCSP12输入电压 3.2 ~ 17.5 V封装 WLCSP12
1 份文档
NX20P5090
High voltage USB PD power switch
厂商恩智浦封装 WLCSP15输入电压 2.5 ~ 20 V封装 WLCSP15
1 份文档
NX30P0121UK工业级
High-voltage back-to-back OVP switch
厂商恩智浦封装 WLCSP12工作温度 -40 ~ 85 °C输入电压 2.5 ~ 20 V
1 份文档
NX30P6093A工业级
High-voltage I2C controlled OVP load switch with
厂商恩智浦封装 WLCSP20工作温度 -40 ~ 85 °C封装 WLCSP20
1 份文档
NX3P1107车规级AEC-Q100
Logic controlled high-side power switch
厂商恩智浦封装 WLCSP4输入电压 0.9 ~ 3.6 V封装 WLCSP4
1 份文档
NX3P1108车规级AEC-Q100
Logic controlled high-side power switch
厂商恩智浦封装 WLCSP4输入电压 0.9 ~ 3.6 V封装 WLCSP4
1 份文档