驱动芯片

共 648 个型号

共 593 个型号· 51 ms

排序默认热度型号 A-Z

安森美恩智浦意法半导体清除筛选

L6229Q
DMOS driver for three-phase brushless DC motor
厂商意法半导体输入电压 8 ~ 52 V
1 份文档
L6230
DMOS driver for three-phase brushless DC motor
厂商意法半导体封装 SO36输入电压 8 ~ 52 V封装 SO36
1 份文档
L6234
Three-phase motor driver
厂商意法半导体输入电压 7 ~ 52 V
1 份文档
L6235
DMOS driver for 3-phase brushless DC motor
厂商意法半导体封装 SO24输入电压 8 ~ 52 V封装 SO24
1 份文档
L6235Q
DMOS driver for three-phase brushless dc motor
厂商意法半导体封装 QFN48输入电压 8 ~ 52 V封装 QFN48
1 份文档
L6246
12V VOICE COIL MOTOR DRIVER
厂商意法半导体工作温度 0 ~ 80 °C
1 份文档
L6258不推荐新设计
PWM controlled high current DMOS universal motor driver
厂商意法半导体输出电流 1.2 A
1 份文档
L6258E不推荐新设计
PWM controlled high current DMOS universal motor driver
厂商意法半导体输出电流 1.2 A
1 份文档
L6258EA
PWM controlled high current DMOS universal motor driver
厂商意法半导体输出电流 1.5 A
1 份文档
L6258EP
PWM controlled high current DMOS universal motor driver
厂商意法半导体输出电流 1.3 A
1 份文档
L6258EX
PWM controlled high current DMOS universal motor driver
厂商意法半导体输出电流 1.5 A
1 份文档
L6384
High-voltage half bridge driver
厂商意法半导体封装 SO8封装 SO8
1 份文档
L6384E
High voltage half-bridge driver
厂商意法半导体封装 DIP-8封装 DIP-8
1 份文档
L6393
Half bridge gate driver
厂商意法半导体
1 份文档
L6452
Dual 13x16 matrix head ink jet driver
厂商意法半导体
1 份文档
L6470
Fully integrated microstepping motor driver with motion engine and SPI
厂商意法半导体封装 HTSSOP28输入电压 8 ~ 45 V封装 HTSSOP28
1 份文档
L6472
Fully integrated microstepping motor driver
厂商意法半导体封装 HTSSOP28输入电压 8 ~ 45 V封装 HTSSOP28
1 份文档
L6474
Fully integrated microstepping motor driver
厂商意法半导体封装 HTSSOP28输入电压 8 ~ 45 V封装 HTSSOP28
1 份文档
L6480
Microstepping motor controller with motion engine and SPI
厂商意法半导体封装 HTSSOP38输入电压 7.5 ~ 85 V封装 HTSSOP38
1 份文档
L6482
Microstepping motor controller with motion engine and SPI
厂商意法半导体封装 HTSSOP38输入电压 7.5 ~ 85 V封装 HTSSOP38
1 份文档