音频放大器 / 音频

共 279 个型号

共 29 个型号· 2 ms

排序默认热度型号 A-Z

DFN TSSOP QFN SSOP DIP 清除筛选

TDA7438
Three bands digitally controlled audio processor
厂商意法半导体封装 DIP28工作温度 0 ~ 70 °C封装 DIP28
1 份文档
TDA7467已停产
Audio matrix with SRS effects
厂商意法半导体封装 DIP28封装 DIP28
1 份文档
TDA7469已停产
Low voltage analog audio processor with headphone power amplifier
厂商意法半导体封装 SSOP24工作温度 0 ~ 70 °C封装 SSOP24
1 份文档
TDA7718B
3 band car audio processor
厂商意法半导体封装 TSSOP28封装 TSSOP28
1 份文档
TDA7719车规级AEC-Q100
Automotive 3 band car audio processor
厂商意法半导体封装 TSSOP28封装 TSSOP28
1 份文档
TS2007已停产
Class D power audio amplifier
厂商意法半导体封装 DFN8输入电压 2.4 ~ 5.5 V封装 DFN8
1 份文档
TS2012
Filter-free stereo 2x2.8 W class D audio power amplifer
厂商意法半导体封装 QFN20封装 QFN20
1 份文档
TS4909
Dual mode low power 150 mW stereo headphone amplifier with capacitor-less and single-ended outputs
厂商意法半导体封装 DFN10封装 DFN10
1 份文档
TS4962
厂商意法半导体封装 DFN8封装 DFN8
1 份文档
TS4984
2x1W stereo audio power amplifier with active low standby mode
厂商意法半导体封装 QFN16输入电压 2.2 ~ 5.5 V封装 QFN16
1 份文档
TS4990
厂商意法半导体封装 DFN8输入电压 2.2 ~ 5.5 V封装 DFN8
1 份文档
TS4997
2x1W differential input stereo audio amplifier with programmable 3D effects
厂商意法半导体封装 QFN16封装 QFN16
1 份文档
NCS8353
Stereo Class D Audio Power Amplifier
厂商安森美封装 QFN32封装 QFN32
1 份文档
TDA7052B
Mono BTL audio amplifier with DC volume control
厂商恩智浦封装 DIP8输入电压 4.5 ~ 18 V封装 DIP8
1 份文档
TDA7053A
Stereo BTL audio output amplifier with DC volume control
厂商恩智浦封装 DIP16输入电压 4.5 ~ 18 V封装 DIP16
1 份文档
TDA8542TS
2 × 0.7 W BTL audio amplifier
厂商恩智浦封装 SSOP20封装 SSOP20
1 份文档
TDA8941P
1.5 W mono Bridge Tied Load (BTL) audio amplifier
厂商恩智浦封装 DIP8封装 DIP8
1 份文档
UDA1345TS
Economy audio CODEC
厂商恩智浦封装 SSOP28封装 SSOP28
1 份文档
TDA7318已停产
Digital controlled stereo audio processor
厂商意法半导体封装 DIP28封装 DIP28
1 份文档
TDA7343已停产
Digitally controlled audio processor
厂商意法半导体封装 DIP28封装 DIP28
1 份文档